EPRUI Biotech provides high quality gold plated spacers for microelectronic packaging in electronics manufacturing.
With better resolutions and decreasing number of circuit chips or modules in liquid-crystal displays (LCD), the input/output (I/O) density in integrated circuit increases while the size and pitch of the interconnection bumps become very small. Au plated particles are electrically conductive and typically dispersed in a binder to form anisotropic conductive adhesive (ACA) materials such as anisotropic conductive film (ACF) or anisotropic conductive paste (ACP) employed in the connection of microelectrodes.
EPRUI supplies gold conductive microspheres have outstanding size uniformity, high conductivity, appropriate elasticity and strong adhesion between the metal layer and the resin core.
Designed specifically for vertical connection of fine-pitch electrodes, Gold conductive microbeads are used, for example, in the interconnect between the two glass panels in the fabrication of LCD cells.